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A hierarchical method of mathematical and computer modeling of interval-stochastic thermal processes in complex electronic systems for various purposes is developed. The developed concept of hierarchical structuring reflects both the constructive hierarchy of a complex electronic system and the hierarchy of mathematical models of heat exchange processes. Thermal processes that take into account various physical phenomena in complex electronic systems are described by systems of stochastic, unsteady, and nonlinear partial differential equations and, therefore, their computer simulation encounters considerable computational difficulties even with the use of supercomputers. The hierarchical method avoids these difficulties. The hierarchical structure of the electronic system design, in general, is characterized by five levels: Level 1 — the active elements of the ES (microcircuits, electro-radio-elements); Level 2 — electronic module; Level 3 — a panel that combines a variety of electronic modules; Level 4 — a block of panels; Level 5 — stand installed in a stationary or mobile room. The hierarchy of models and modeling of stochastic thermal processes is constructed in the reverse order of the hierarchical structure of the electronic system design, while the modeling of interval-stochastic thermal processes is carried out by obtaining equations for statistical measures. The hierarchical method developed in the article allows to take into account the principal features of thermal processes, such as the stochastic nature of thermal, electrical and design factors in the production, assembly and installation of electronic systems, stochastic scatter of operating conditions and the environment, non-linear temperature dependencies of heat exchange factors, unsteady nature of thermal processes. The equations obtained in the article for statistical measures of stochastic thermal processes are a system of 14 non-stationary nonlinear differential equations of the first order in ordinary derivatives, whose solution is easily implemented on modern computers by existing numerical methods. The results of applying the method for computer simulation of stochastic thermal processes in electron systems are considered. The hierarchical method is applied in practice for the thermal design of real electronic systems and the creation of modern competitive devices.

The article is devoted to the effect of thermal feedback, which occurs during the operation of integrated circuits and electronic systems with their use. Thermal feedback is due to the fact that the power consumed by the functioning of the microchip heats it and, due to the significant dependence of its electrical parameters on temperature, interactive interaction arises between its electrical and thermal processes. The effect of thermal feedback leads to a change in both electrical parameters and temperature levels in microcircuits. Positive thermal feedback is an undesirable phenomenon, because it causes the output of the electrical parameters of the microcircuits beyond the permissible values, the reduction in reliability and, in some cases, burn out. Negative thermal feedback is manifested in stabilizing the electrical and thermal regimes at lower temperature levels. Therefore, when designing microcircuits and electronic systems with their application, it is necessary to achieve the implementation of negative feedback. In this paper, we propose a method for modeling of thermal modes in electronic systems, taking into account the effect of thermal feedback. The method is based on introducing into the thermal model of the electronic system new model circuit elements that are nonlinearly dependent on temperature, the number of which is equal to the number of microcircuits in the electronic system. This approach makes it possible to apply matrix-topological equations of thermal processes to the thermal model with new circuit elements introduced into it and incorporate them into existing thermal design software packages. An example of modeling a thermal process in a real electronic system is presented, taking into account the effect of thermal feedback on the example of a microcircuit installed on a printed circuit board. It is shown that in order to adequately model the electrical and thermal processes of microcircuits and electronic systems, it is necessary to take into account the effects of thermal feedback in order to avoid design errors and create competitive electronic systems.