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  1. Karaban V.M., Sukhorukov M.P., Morozov E.A.
    Software implementation of the three-dimensional modeling of thermal processes in multilayer integrated circuits for space purposes
    Computer Research and Modeling, 2014, v. 6, no. 3, pp. 397-403

    In this paper we consider software implementation of three-dimensional modeling of thermal processes in multilayer integrated circuits based on low-temperature co-veneering ceramic. The results obtained by the software implemented by the example of the radio frequency receiver module based on low-temperature ceramics for autonomous navigation systems. And also provides a comparison with the results of certified software product.

    Keywords: multilayer integrated circuits, low-temperature co-fired ceramic, thermal conditions, space equipment, mathematical modeling, and differential equations.
    Views (last year): 4. Citations: 1 (RSCI).

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