Software implementation of the three-dimensional modeling of thermal processes in multilayer integrated circuits for space purposes

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In this paper we consider software implementation of three-dimensional modeling of thermal processes in multilayer integrated circuits based on low-temperature co-veneering ceramic. The results obtained by the software implemented by the example of the radio frequency receiver module based on low-temperature ceramics for autonomous navigation systems. And also provides a comparison with the results of certified software product.

Keywords: multilayer integrated circuits, low-temperature co-fired ceramic, thermal conditions, space equipment, mathematical modeling, and differential equations
Citation in English: Karaban V.M., Sukhorukov M.P., Morozov E.A. Software implementation of the three-dimensional modeling of thermal processes in multilayer integrated circuits for space purposes // Computer Research and Modeling, 2014, vol. 6, no. 3, pp. 397-403
Citation in English: Karaban V.M., Sukhorukov M.P., Morozov E.A. Software implementation of the three-dimensional modeling of thermal processes in multilayer integrated circuits for space purposes // Computer Research and Modeling, 2014, vol. 6, no. 3, pp. 397-403
DOI: 10.20537/2076-7633-2014-6-3-397-403
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